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P01 1:1 model · not yet built

Digital IC tester

A bench tester for 74xx and 4000-series DIP logic chips: 28 channels, one ZIF socket and an ESP32-S3. ScrollSwipe the cards to take it apart, one layer at a time.

Status
Design stage
Enclosure
196 × 126 × 20.9 mm
Main PCB
190 × 120 × 1.6 mm

01 Enclosure

Four screws from below

Four M3×14 socket caps pass up through the corner columns of the base and into heat-set inserts in the lid. Four 12 × 3 mm rubber feet sit under the floor.

Walls, floor
2.5 mm, 2.5 mm
Base / lid split
Z 12.0 mm

02 Lid

The lid lifts off

A printed 2.5 mm top that fits over a 1.5 mm alignment lip on the base with 0.1 mm clearance. It prints upside down, top face on the bed. Cutouts let the TFT, the ZIF socket, the keypad tail, a light pipe and the buzzer through.

TFT window
60.5 × 46.2 mm
ZIF opening
67.8 × 32.4 mm

03 Input

Membrane keypad

A 4×4 membrane keypad sticks to the lid. Its 20 mm tail drops through a slot in front of it to a right-angle 1×8 header on the main board.

Keypad
69.2 × 76.9 × 0.8 mm
Source
Typical listing, to be measured

04 Device under test

Socket and chip

A 40-pin universal ZIF socket takes 0.3 in and 0.6 in DIPs and stands 5.2 mm above the lid. It plugs into a turned-pin DIP-40 socket on the main board, so a worn one lifts straight out through the lid opening and a spare goes in. Pin 1 goes at the lever end, on the left. The 74LS00 is shown inserted that way.

Length
61.2 mm body, 65.8 with lever
Width, height
25.4, 11.9 mm (typical)

05 Display

2.8 in TFT

An ILI9341 SPI module (MSP2807). Its 14-pin header is soldered into the main board and holds the module in place. Four 2.5 mm nylon spacers carry it and four nylon dowels locate it. The glass ends 0.2 mm under the lid.

Module PCB
86 × 50 × 1.6 mm
Visible area
59.45 × 45.2 mm

06 Main board

The main PCB comes out

It sits on four 6 mm standoffs. This is the Rev A board from KiCad: four layers, routed, no DRC errors. The 28 channel cells sit in two bands behind the ZIF, each with a high-side and a low-side MOSFET and eight resistors. The shift registers and strong drivers sit under the TFT, where nothing is taller than 2.3 mm, and the four MCP23S17 expanders are to its right.

Not ordered or built yet, and no second person has reviewed the layout.

07 Controller

ESP32-S3 module, on the board

An ESP32-S3-WROOM-1 module is soldered straight to the main board, its antenna end on the back edge. Nothing hangs underneath, so the board sits on 6 mm standoffs and the enclosure is 12 mm lower than with a development board.

Module
18 × 25.5 × 3.1 mm
Radio
Not used

08 Back wall

One USB-C port

The only connector. It brings in 5 V and the ESP32-S3’s native USB: console, firmware updates and chip-library uploads. A buck-boost regulator beside it makes the 5 V rail. The receptacle face sits at the inside of the wall, so the opening is sized for the plug’s overmold, not the receptacle.

Opening
13 × 7 mm at X 140
Receptacle
16-pin top mount, typical

09 Assembly

Every part, 1:1

Parts with a datasheet drawing use its sizes. The ZIF width and height, its turned-pin socket, the keypad and the USB-C receptacle are typical values to measure on the real parts. Nothing has been printed or built yet.

Open the interactive model

Design

One channel, 28 times

Every socket contact gets the same cell, so firmware decides what each pin is. Power and ground can land on any pin: the 7490, for example, has VCC on pin 5. Every pin also goes through a mux to a buffered ADC, so the tester reads voltages and compares them with the TTL or CMOS limits for that chip.

One socket channel, repeated 28 times Any ZIF contact can become VCC, GND, a driven input or a measured output. Both FETs are held off at reset. VDUT eFuse TPS2553 + 0.2 Ω shunt (INA226) Q_H AO3401A P-FET: pin → VCC 74HCT595 bit, active low 10 kΩ gate pull-up: off at reset socket channel n Q_L AO3400A N-FET: pin → GND 74HCT595 bit, active high 10 kΩ gate pull-down: off at reset MCP23S17: drive 0 / 1 470 Ω MCP23S17: weak pull ↑ / ↓ 22 kΩ 74ACT125: strong drive 110 Ω 4067 mux → buffer → ADC 1 kΩ ZIF socket 74LS00 Strong path (110 Ω) is enabled per pin by four more 74HCT595s, only when a driven-low pin reads 0.8–2.4 V. Values from Rev A.
The per-channel circuit, with Rev A values.

The 470 Ω drive limits the current if a chip output fights it, but the calculations showed that standard-TTL clock inputs pull it too far. So Rev A adds a 110 Ω strong path, which firmware switches on for one pin at a time, and only when that driven-low pin reads between 0.8 V and 2.4 V.

good 7400
  7400 powered, supply current 2.00 mA
  PASS: 7400, 6 checks

7400 with gate 1 stuck low
  line 14: pin 3 (1Y) should be H, reads 0.20 V
  line 15: pin 3 (1Y) should be H, reads 0.20 V
  ...
  FAIL: 7400, 4 of 6 checks failed

7400 inserted backwards
  supply current 250.0 mA is over the 60 mA limit:
  check orientation and chip type
Output of the prototype firmware on a PC, against a simulated breadboard. Not a bench run.
Status

Where it stands

Everything here is a design, a calculation or a simulation. No board has been ordered, no firmware has been flashed and nothing has been measured.

KiCad render of the routed Rev A board, top side: the DIP-40 socket at the front left, two bands of channel cells behind it, shift registers and strong drivers above them, interface chips in the middle, and the ESP32-S3 module and USB-C connector at the back right.
The routed Rev A board, rendered by KiCad: four layers, 436 parts, 27.8 m of track.

What has been checked

Recorded on 2 November 2026. The library and firmware tests were run again on 5 November.

CheckResult
Schematic ERC, KiCad's own tool0 violations
KiCad's netlist against the design description, pin for pin306 nets, 0 differences
Board DRC with schematic parity0 errors, 0 unrouted, 18 silkscreen warnings
Board model in the enclosure model0 overlaps; tallest part under the TFT 1.84 mm of 2.3 mm
Firmware tests on a PC, against a register-level model of the board116 of 116 pass (simulated)
Firmware board map against the Rev A netlist, pin by pinNo differences
Production firmware compiled for the ESP32-S3Passes; not flashed
Chip library checker59 files, 0 errors

What the checks found

  • USB inrush. The input capacitors came to about 13 µF after derating, above the 10 µF a USB device may present when plugged in. A soft-start switch and a slower converter start now hold the peak at about 0.4 A (calculated).
  • Floating inputs. With the socket empty, the strong drivers' inputs could sit at mid-rail and draw current or oscillate. Each line now has a 330 kΩ pull-down.
  • The ADC's blind spot. The ESP32-S3's ADC reads 0 for anything below its zero, which left 37 mV of error near 0 V in simulation, against a 30 mV target. A factory load board now gives a second calibration point, which brings it to 2.1 mV in simulation.
  • A slow fight check. A chip output fighting the strong path was caught after 198 µs, at the edge of the 200 µs target. A shorter check does it in 73 µs, also simulated.

Not done yet

  • The four-channel breadboard prototype, and any bench measurement.
  • The fabricator's design check on the Rev A board, a real quote and the order.
  • Flashing the firmware. The display, keypad, storage and real timings have never run on a board.
  • Running the chip library on real chips, and a second reader for the newest 37 of the 59 files.
  • Printing the enclosure and fit-testing it on real parts.

Next

Build the four-channel prototype on a breadboard, run the empty-socket self-test and then a known-good 74LS00, and record the real supply current and output voltages. Those measurements replace the design's assumptions and decide whether Rev A goes to fabrication as it stands.

Model

Open the model

The model is parametric: every dimension is a named constant, so changing one and rebuilding updates every part. It is a design, not a measured prototype. The main board in it is the routed Rev A board from KiCad. Nothing has been printed or tested yet.

Questions

About the IC tester

What chips does the IC tester test?

74xx and 4000-series logic chips in DIP packages. A 40-pin universal ZIF socket takes both 0.3 in and 0.6 in wide DIPs, and the tester has 28 channels.

Has the IC tester been built?

Not yet. It is in the design stage. The Rev A schematic and four-layer board are routed and pass KiCad's electrical and design rule checks, and the firmware passes its tests in simulation. No board has been ordered, no firmware has been flashed, and nothing has been printed, built or measured.

What does it report when a chip fails?

It is designed to name the failing pin, the gate it belongs to, the level it expected and the voltage it measured. A chip inserted backwards trips a current limit, and the tester switches its supply off before reporting it.

How many chips can it test?

The library has 59 chip files: 47 for 74xx parts and 12 for 4000-series parts. Each one is a plain text file, so adding a chip needs no new firmware. None has been run on a real chip yet.

What is inside the IC tester?

An ESP32-S3-WROOM-1 module soldered to the main board, four MCP23S17 I/O expanders, eleven 74HCT595 shift registers, seven 74ACT125 strong drivers, two CD74HCT4067 sense muxes and 28 channel cells, each with a high-side and a low-side MOSFET and eight resistors. A 2.8 in ILI9341 SPI TFT sits on the main board and a 4×4 membrane keypad sits on the lid.

How big is the IC tester?

The enclosure is 196 × 126 × 20.9 mm, or 23.9 mm tall on its rubber feet. The main PCB is 190 × 120 × 1.6 mm.

How is the IC tester powered and connected?

Through one USB-C port in the back wall. It brings in 5 V and the ESP32-S3 native USB, for the console and firmware updates, and a buck-boost regulator beside it makes the 5 V rail for the board.

Can I download the IC tester 3D model?

Yes. Open the interactive model to orbit, explode, section and measure it in the browser, or download the full assembly as a 10.6 MB glTF file, ic-tester-assembly.glb, for Blender or any web viewer.

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